US Patent Issued to City University of Hong Kong on Sept. 22 for "Thin film based structures of an electronic device and a method of making" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,564, issued on Sept. 22, was assigned to City University of Hong Kong (Kowloon, Hong Kong).

"Thin film based structures of an electronic device and a method of making" was invented by Zhengbao Yang (Kowloon, Hong Kong) and Shiyuan Liu (Kowloon, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a thin film based structure. The method includes (a): forming an electrically conductive layer on a substrate such that the electrically conductive layer is releasably attached to the substrate. The method also includes (b): forming a ceramic or metallic thin film on the electrically conductive layer, on a side opposite the substrate...