US Patent Issued to CITY UNIVERSITY OF HONG KONG on July 21 for "Solder alloy composition, its preparation method and uses in room-temperature rapid solid-state soldering" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,083, issued on July 21, was assigned to CITY UNIVERSITY OF HONG KONG (Kowloon, Hong Kong).

"Solder alloy composition, its preparation method and uses in room-temperature rapid solid-state soldering" was invented by King-Ning Tu (Kowloon, Hong Kong) and Yingxia Liu (Kowloon, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are a solder alloy composition comprising Sn-Bi-In base solder particles. The Sn-Bi-In base solder particles is characterized by having an average diameter less than 10 micro metre, and the Sn-Bi-In base alloy comprises 12-22% of Sn, 33-43% of Bi and 45-55% by weight. Also disclosed herein is a method for p...