US Patent Issued to City University of Hong Kong on Feb. 3 for "Two-dimensional microstrip patch antennas and arrays with radiation pattern decoupling" (Chinese, Chinese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,373, issued on Feb. 3, was assigned to City University of Hong Kong (Kowloon, Hong Kong).

"Two-dimensional microstrip patch antennas and arrays with radiation pattern decoupling" was invented by Kwok Wa Leung (Kowloon Tong, Hong Kong), Guangyao Liu (Kowloon Tong, Hong Kong), Nan Yang (Guangzhou, China) and Kwai Man Luk (Kowloon Tong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microstrip antenna which includes a substrate, a ground on a second side of the substrate, a first patch on a first side of the substrate, and a second patch on the first side of the substrate. The first patch is connected to a first port. The second patch is sep...