ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,396, issued on March 31, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.).
"Via assembly for printed circuit board" was invented by Mike Sapozhnikov (San Jose, Calif.), Amendra Koul (San Francisco), David Nozadze (San Jose, Calif.), Joel Richard Goergen (Soulsbyville, Calif.), Upen Reddy Kareti (Union City, Calif.) and Sayed Ashraf Mamun (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signa...