ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,590, issued on Dec. 23, was assigned to Cisco Technology Inc. (San Jose, Calif.).
"Optical wafer-level package" was invented by Norbert Schlepple (Macungie, Pa.), Aparna R. Prasad (San Jose, Calif.) and Vipulkumar K. Patel (Breinigsville, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside e...