ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,874, issued on April 14, was assigned to Ciena Corp. (Hanover, Md.).
"Managing temperatures in integrated circuits" was invented by Raphael Beaupre-Laflamme (Quebec, Canada) and Lam Nguyen (Quebec, Canada).
According to the abstract* released by the U.S. Patent & Trademark Office: "An article of manufacture comprises: a first integrated circuit, with a cavity formed through an entire thickness between a first surface of the first integrated circuit and a second surface of the first integrated circuit; a second integrated circuit having a size such that at least a portion of the second integrated circuit fits within at least a portion of the cavity; and a thermally conductive str...