US Patent Issued to CHROMA ATE on April 21 for "Method and apparatus for testing a package-on-package semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,670, issued on April 21, was assigned to CHROMA ATE INC. (Taoyuan City, Taiwan).

"Method and apparatus for testing a package-on-package semiconductor device" was invented by Chin-Yi Ouyang (Taoyuan City, Taiwan), Xin-Yi Wu (Taoyuan City, Taiwan), Chien-Ming Chen (Taoyuan City, Taiwan), Meng-Kung Lu (Taoyuan City, Taiwan) and Chia-Hung Chien (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tes...