US Patent Issued to CHIPBOND TECHNOLOGY on Feb. 24 for "Inner lead structure of flexible circuit board" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,056, issued on Feb. 24, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Inner lead structure of flexible circuit board" was invented by Wen-Ping Hsu (Kaohsiung City, Taiwan) and Yi-Ling Hsieh (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inner lead structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer. A chip mounting area defined on the flexible substrate is provided for a chip, contacting locations defined within the chip mounting area are provided for conductive elements of the chip. The circuit layer includes inner leads, ends of the inner leads ar...