US Patent Issued to CHIPBOND TECHNOLOGY on Feb. 10 for "Layout structure of flexible circuit board" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,764, issued on Feb. 10, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Layout structure of flexible circuit board" was invented by Hou-Chang Kuo (Kaohsiung, Taiwan), Wen-Ping Hsu (Kaohsiung, Taiwan), Ting-Yi Kuo (Kaohsiung, Taiwan) and Yi-Ling Hsieh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the ...