US Patent Issued to CHINA CONSTRUCTION SCIENCE AND INDUSTRY on Aug. 18 for "Free-expansion deformation seam structure applied to floor" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,889, issued on Aug. 18, was assigned to CHINA CONSTRUCTION SCIENCE AND INDUSTRY CORPORATION LTD. (Shenzhen, China).

"Free-expansion deformation seam structure applied to floor" was invented by Minghua Huang (Shenzhen, China), Huihong Gu (Shenzhen, China), Dongliang Zhang (Shenzhen, China), Zongzhao Chen (Shenzhen, China), Mingzhi Chen (Shenzhen, China) and Guangning Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A free-expansion deformation seam structure applied to a floor, including: a first base, a second base, a cover plate, a first telescopic component and a second telescopic component. A bottom of the cover plate is provi...