ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,518, issued on Dec. 23, was assigned to CHENMKO ENTERPRISE Co. LTD. (New Taipei, Taiwan).
"Diode package for series circuit" was invented by Huang-Shun Liao (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A diode package for series circuit includes a plurality of conductive bearing frames, a plurality of diode chips and a plurality of conductive bridging frames. Each the bearing frame has a chip setting portion or a bridging portion, or has a chip setting portion and a bridging portion bent in the chip setting portion. Each the diode chip is disposed on each chip setting portion. Each the bridging frame bridges between two adjacen...