ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,096, issued on Jan. 20, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).
"Chip on flex" was invented by Xuerui Gong (Beijing), Jiangsheng Wang (Beijing), Yong Yu (Beijing) and Chang Zhang (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is ...