US Patent Issued to Celestial AI on March 3 for "Preserving access to edge coupling components on a wafer package" (California, Arizona Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,305, issued on March 3, was assigned to Celestial AI Inc. (Santa Clara, Calif.).

"Preserving access to edge coupling components on a wafer package" was invented by Ankur Aggarwal (Pleasanton, Calif.), Anmol Rathi (San Jose, Calif.) and Suresh Venkata Pothukuchi (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve techniques for packaging an electro-photonic circuit while preserving access to a grating coupler, which may involve using a sacr...