US Patent Issued to CASBOSON TECHNOLOGY (LIYANG) on Sept. 8 for "Preparation method for semiconductor material leg array and batch preparation method for interface layer of semiconductor material leg array" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,402, issued on Sept. 8, was assigned to CASBOSON TECHNOLOGY (LIYANG) Co. LTD (Liyang, China).

"Preparation method for semiconductor material leg array and batch preparation method for interface layer of semiconductor material leg array" was invented by Xun Shi (Shanghai), Ming Gu (Shanghai), Pengfei Qiu (Shanghai) and Lidong Chen (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a preparation method for a semiconductor material leg array and a batch preparation method for an interface layer of a semiconductor material leg array. The preparation method for a semiconductor material leg array comprises: placing a...