US Patent Issued to Carl Zeiss SMT on Oct. 20 for "Method of 3D volume inspection of semiconductor wafers with increased throughput" (German, American Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,804, issued on Oct. 20, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany).

"Method of 3D volume inspection of semiconductor wafers with increased throughput" was invented by Dmitry Klochkov (Schwabisch Gmund, Germany), Jens Timo Neumann (Aalen, Germany), Thomas Korb (Schwabisch Gmund, Germany), Eugen Foca (Ellwangen, Germany), Amir Avishai (Pleasanton, Calif.) and Alex Buxbaum (San Ramon, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and a method for volume inspection of semiconductor wafers with increased throughput are configured for milling and imaging a reduced number or areas of appropriate cross-sections surfaces in an...