US Patent Issued to Carl Zeiss SMT on Feb. 17 for "Methods of cross-section imaging of an inspection volume in a wafer" (German, American Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,588, issued on Feb. 17, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany).

"Methods of cross-section imaging of an inspection volume in a wafer" was invented by Alex Buxbaum (San Ramon, Calif.), Eugen Foca (Ellwangen, Germany), Chuong Huynh (Quincy, Mass.), Dmitry Klochkov (Schwaebisch Gmuend, Germany), Thomas Korb (Schwaebisch Gmuend, Germany), Jens Timo Neumann (Aalen, Germany) and Baohua Niu (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to dual beam device and three-dimensional circuit pattern inspection techniques by cross sectioning of inspection volumes with large depth extension excee...