US Patent Issued to Canon on Sept. 9 for "Method for manufacturing element substrate, element substrate, and liquid ejection head" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,656, issued on Sept. 9, was assigned to Canon K.K. (Tokyo).

"Method for manufacturing element substrate, element substrate, and liquid ejection head" was invented by Tetsushi Ishikawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing an element substrate for use in a liquid ejection head for ejecting a liquid to a recording medium. The element substrate, includes: a substrate having a nozzle including an ejection port, and a pressure generating chamber communicating with the nozzle, and subjected to a liquid repellent treatment on a part of a surface on a side opposed to the recording medium; and a generat...