US Patent Issued to Canon on May 19 for "Semiconductor device, equipment, and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,269, issued on May 19, was assigned to Canon K.K. (Tokyo).

"Semiconductor device, equipment, and manufacturing method of semiconductor device" was invented by Takuya Hara (Kanagawa, Japan) and Takumi Ogino (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor component including a first semiconductor substrate and a first wiring structure, and a second semiconductor component including a second semiconductor substrate and a second wiring structure. A first surface of the first semiconductor component and a second surface of the second semiconductor component are bonded together. Assuming that regi...