US Patent Issued to Canon on June 23 for "Laminated substrate, liquid ejection head, and method of manufacturing laminated substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,893, issued on June 23, was assigned to Canon K.K. (Tokyo).

"Laminated substrate, liquid ejection head, and method of manufacturing laminated substrate" was invented by Atsunori Terasaki (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a laminated substrate, a liquid ejection head, and a method of manufacturing a laminated substrate which are capable of preventing a decrease in the yield of a manufacturing process due to the substrate getting broken and an organic resin material sticking out. To that end, a structure including an eave portion having an overhang with a predetermined length is provided on a prede...