US Patent Issued to Canon on Jan. 20 for "Dicing method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,762, issued on Jan. 20, was assigned to Canon K.K. (Tokyo).

"Dicing method" was invented by Tetsuro Yasukawa (Chiba, Japan) and Takeshi Shibata (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dicing method including the steps of: bonding a first wafer having a first wafer resistivity and a second wafer having a second wafer resistivity higher than the wafer first resistivity, thereby forming a bonded wafer; irradiating the bonded wafer with a laser while varying focal lengths in a thickness direction of the bonded wafer, thereby forming a plurality of modified regions along a dicing line; and dicing the bonded wafer along the dicin...