US Patent Issued to C. UYEMURA & Co. on July 14 for "Electroless ruthenium plating bath" (Japanese, Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,170, issued on July 14, was assigned to C. UYEMURA & Co. LTD. (Osaka, Japan).

"Electroless ruthenium plating bath" was invented by Yoshihito II (Osaka, Japan), Yoichi Maruo (Osaka, Japan) and Yukinori Oda (Jurong, Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electroless ruthenium plating bath at least contains: a ruthenium compound; a reducing agent; and a stabilizer. The reducing agent is at least one of an amine borane compound or sodium hypophosphite. The stabilizer is made of a hydroxylamine compound and an amine compound. The hydroxylamine compound is at least one of hydroxylamine sulfate or hydroxylamine chloride."

The patent w...