US Patent Issued to BYSTRONIC LASER on June 30 for "Thickness compensation in a cutting and bending process" (Swiss Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,801, issued on June 30, was assigned to BYSTRONIC LASER AG (Niederoenz, Switzerland).

"Thickness compensation in a cutting and bending process" was invented by Gerrit J. W. Gerritsen (Cuarnens, Switzerland) and Wilfried Liegard (Bern, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a computer-implemented method and a planer for calculating at least one supplementary processing plan for a workpiece to be processed by a processing machine. The method comprises the steps of: Measuring workpiece properties, including a thickness parameter of the workpiece; Providing at least one supplementary processing plan, ...