US Patent Issued to Bystronic Laser on Dec. 23 for "Laser cutting method and machine" (Italian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,733, issued on Dec. 23, was assigned to Bystronic Laser AG (Niederonz, Switzerland).

"Laser cutting method and machine" was invented by Luca Fontana (Ospitaletto, Italy), Hisham Skayky (Brescia, Italy) and Davide Taroni (Carate Urio, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure concerns a laser processing machine for processing elongate workpieces, for example tubes. The machine comprises a fixture for fixing an elongate workpiece relative to a machine part. The fixture has a pair of first clamping members and a pair of second clamping members. The first clamping members and the second clamping members each have a clamping fac...