US Patent Issued to BorgWarner US Technologies on Nov. 25 for "Systems and methods for a top side cooled power semiconductor thermal interface spacer" (Indiana Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,197, issued on Nov. 25, was assigned to BorgWarner US Technologies LLC (Wilmington, Del.).

"Systems and methods for a top side cooled power semiconductor thermal interface spacer" was invented by Alexandre M. S. Reis (Westfield, Ind.), Bryan Alan Rohl (Westfield, Ind.) and Thomas Alan Degenkolb (Noblesville, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package includes: a first power semiconductor; a cold plate including a floor and a first pedestal extending from the floor, wherein the first pedestal is configured to support the first power semiconductor; a thermal interface material configured to transfer heat from the...