ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,029, issued on April 21, was assigned to BorgWarner US Technologies LLC (Wilmington, Del.).
"Systems for molding metal sheet into inverter for improving emc performance" was invented by Hongjun Luo (Singapore), Jun Jie How (Singapore), Kin Yean Chow (Singapore), Edmund Lim (Singapore) and Yew Ming Chong (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "An inverter may include a housing having a body and a protruding rim extending from the body, wherein the protruding rim surrounds a cavity that extends through to the body. An inverter may include one or more electrical receptacles, wherein the one or more electrical receptacles are disposed...