ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,799, issued on July 28, was assigned to BONDTECH Co. LTD. (Kyoto, Japan).
"Bonding method, bonded article, and bonding device" was invented by Akira Yamauchi (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultravi...