US Patent Issued to BOE Technology Group on Sept. 9 for "Back plate and manufacturing method thereof, method for bonding chip, and display device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,866, issued on Sept. 9, was assigned to BOE Technology Group Co. Ltd. (Beijing).

"Back plate and manufacturing method thereof, method for bonding chip, and display device" was invented by Guangcai Yuan (Beijing), Zhiwei Liang (Beijing), Ke Wang (Beijing) and Zhanfeng Cao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A back plate and a manufacturing method thereof, a method for bonding a chip, and a display device are provided. The back plate includes: a base substrate; and, a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrat...