US Patent Issued to BOE TECHNOLOGY GROUP on March 24 for "Modeling method, device, and system for three-dimensional head model, and storage medium" (Chinese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,329, issued on March 24, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Modeling method, device, and system for three-dimensional head model, and storage medium" was invented by Hua Bai (Beijing), Jinan Li (Beijing) and Yangyang Liu (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a method, device, system for modeling a three-dimensional head model, and a storage medium. The modeling method includes: acquiring at least one facial image of a user; acquiring facial contour feature points in the at least one facial image of the user, the facial contour feature points being capable of characterizing a contour of a face or...