US Patent Issued to BOE TECHNOLOGY GROUP on March 17 for "Wiring board, functional backplane and method for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,596, issued on March 17, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Wiring board, functional backplane and method for manufacturing the same" was invented by Nianqi Yao (Beijing), Feifei Li (Beijing), Ce Ning (Beijing), Zhengliang Li (Beijing), Hehe Hu (Beijing), Jiayu He (Beijing), Jie Huang (Beijing), Kun Zhao (Beijing), Zhanfeng Cao (Beijing) and Ke Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a base substrate and first connection pads disposed on the base substrate. The first connection pads each include electrical connection layer(s); each electrical connection layer includes a main materi...