US Patent Issued to BOARDTEK ELECTRONICS on Sept. 23 for "Packaging structure with embedded power chip and circuit board module having the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,536, issued on Sept. 23, was assigned to BOARDTEK ELECTRONICS Corp. (Taoyuan, Taiwan).

"Packaging structure with embedded power chip and circuit board module having the same" was invented by Chien-Cheng Lee (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure and a circuit board having the packaging structure are provided. The packaging structure includes a power chip, a wire, a grid terminal, a first soldering layer, a second soldering layer, a first frame, a second frame, and a packaging body. The power chip has a grid electrode, a source electrode, and a drain electrode. The grid terminal is connected to the g...