US Patent Issued to BOARDTEK ELECTRONICS on April 21 for "Circuit board and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,454, issued on April 21, was assigned to BOARDTEK ELECTRONICS Corp. (Taoyuan City, Taiwan).

"Circuit board and manufacturing method thereof" was invented by Chung-Hsing Liao (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes a first external wiring layer, a second external wiring layer, a first internal structure, and a second internal structure. The first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer. The first internal structure includes a first metal block extending from the first external wiring layer to th...