US Patent Issued to Biolinq on Oct. 27 for "Heterogeneous integration of silicon-fabricated solid microneedle sensors and CMOS circuitry" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,166, issued on Oct. 27, was assigned to Biolinq Inc. (San Diego).

"Heterogeneous integration of silicon-fabricated solid microneedle sensors and CMOS circuitry" was invented by Joshua Windmiller (San Diego) and Jared Rylan Tangney (Encinitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A skin-adorned physiological or biochemical sensing device is disclosed herein. The device preferably comprises a first substrate and a second substrate. The first substrate comprises an array of solid microneedles designed to penetrate a biological interface to access a physiological fluid or tissue. Each microneedle is capable of electrical interface with ...