US Patent Issued to BenQ Materials on Sept. 1 for "Water-based hot melt adhesive and nonwoven coated with the water-based hot melt adhesive" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,177, issued on Sept. 1, was assigned to BenQ Materials Corp. (Taoyuan City, Taiwan).

"Water-based hot melt adhesive and nonwoven coated with the water-based hot melt adhesive" was invented by Ching-Huang Chen (Taoyuan City, Taiwan), Kuo-Hsuan Yu (Taoyuan City, Taiwan) and Yen-Ling Lin (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is to provide a water-based hot melt adhesive for healthcare packaging. The water-based hot melt adhesive includes 100 weight parts of water-based polyolefin resin; 40 to 85 weight parts of wax particles; and 25 to 85 parts by weight of tackifier particles; wherein a total weigh...