US Patent Issued to Beijing Xiaomi Mobile Software on Feb. 24 for "Loop heat pipe, housing assembly and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,700, issued on Feb. 24, was assigned to Beijing Xiaomi Mobile Software Co. Ltd. (Beijing).

"Loop heat pipe, housing assembly and electronic device" was invented by Mingyan Liu (Beijing), Anqi Chen (Beijing), Duzi Huang (Beijing) and Longhua Duan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A loop heat pipe includes a housing component, a first capillary structure and a second capillary structure. The housing component is provided with a pipeline unit, a first partition part and at least two evaporation cavities. The evaporation cavity includes a vapor outlet communicated with one end of the pipeline unit and a liquid replenishment port co...