US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on May 19 for "Wafer cleaning equipment, wafer chuck, and wafer cleaning method" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,476, issued on May 19, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Wafer cleaning equipment, wafer chuck, and wafer cleaning method" was invented by Hongyu Zhao (Beijing), Aibing Li (Beijing) and Ruiting Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wafer chuck in semiconductor cleaning equipment, including a chuck base, a jetting assembly arranged on the chuck base, and a plurality of wafer lifting shafts arranged on the chuck base. The chuck base includes a carrier surface for supporting the wafer. The gas outlet of the jetting assembly is located in the center area ...