US Patent Issued to BEIJING BOE TECHNOLOGY DEVELOPMENT on Dec. 2 for "Detection chip, method for manufacturing detection chip, method for operating detection chip, and reaction system" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,415, issued on Dec. 2, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing).

"Detection chip, method for manufacturing detection chip, method for operating detection chip, and reaction system" was invented by Zijian Zhao (Beijing), Shinying Lau (Beijing) and Ruijun Deng (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A detection chip, a method for manufacturing a detection chip, a method for operating a detection chip, and a reaction system are disclosed. The detection chip includes a first substrate, a micro-cavity definition layer, and a heating electrode. The micro-cavity definition layer defines a plurality of micro-react...