US Patent Issued to Beijing BOE Technology Development, BOE TECHNOLOGY GROUP on April 21 for "Detection chip, and manufacturing method and sample introduction method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,706, issued on April 21, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Detection chip, and manufacturing method and sample introduction method thereof" was invented by Kang Peng (Beijing), Beiyuan Fan (Beijing) and Ding Ding (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a detection chip, including: a micro-cavity-defining layer having a plurality of micro-pores extending through the micro-cavity-defining layer are arranged; and a ventilative liquid-resistant layer on a side of the micro-cavity-defining layer and completely covering openin...