US Patent Issued to BASF on June 2 for "Heat-aging resistant polyamide molding compositions" (German Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,992, issued on June 2, was assigned to BASF SE (Ludwigshafen am Rhein, Germany).

"Heat-aging resistant polyamide molding compositions" was invented by Sebastian Wagner (Ludwigshafen, Germany) and Mathias Feil (Ludwigshafen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight Mn of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phen...