US Patent Issued to BASF on April 21 for "Composition for copper bump electrodeposition comprising a leveling agent" (German Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,925, issued on April 21, was assigned to BASF SE (Ludwigshafen am Rhein, Germany).

"Composition for copper bump electrodeposition comprising a leveling agent" was invented by Nadine Engelhardt (Ludwigshafen, Germany), Alexander Fluegel (Ludwigshafen, Germany), Marco Arnold (Ludwigshafen, Germany) and Charlotte Emnet (Ludwigshafen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a composition for copper bump electrodeposition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of fr...