US Patent Issued to Ayar Labs on July 14 for "Direct silicon-to-silicon bonding for fiber-first packaging process" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,245, issued on July 14, was assigned to Ayar Labs Inc. (San Jose, Calif.).

"Direct silicon-to-silicon bonding for fiber-first packaging process" was invented by Chong Zhang (San Jose, Calif.), Haiwei Lu (Santa Clara, Calif.) and Steve Groothuis (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to t...