US Patent Issued to AvicenaTech on July 21 for "Packaging for microLEDs for chip to chip communication" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,674, issued on July 21, was assigned to AvicenaTech Corp. (Sunnyvale, Calif.).

"Packaging for microLEDs for chip to chip communication" was invented by Bardia Pezeshki (Sunnyvale, Calif.), Robert Kalman (Sunnyvale, Calif.) and Alex Tselikov (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters."

The patent was filed on Nov. 21, 2023, under Application No. 18/515,869.

*For further information,...