US Patent Issued to Averatek on Feb. 10 for "Methods and devices for high resistance and low resistance conductor layers mitigating skin depth loss" (California Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,695, issued on Feb. 10, was assigned to Averatek Corp. (Santa Clara, Calif.).

"Methods and devices for high resistance and low resistance conductor layers mitigating skin depth loss" was invented by Shinichi Iketani (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed ...