US Patent Issued to Avago Technologies International Sales on March 31 for "Semiconductor package with side wall interconnection" (California, Colorado Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,726, issued on March 31, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Semiconductor package with side wall interconnection" was invented by Sam Karikalan (Ladera Ranch, Calif.), Sam Zhao (Irvine, Calif.), Mayank Mayukh (Fort Collins, Colo.), Liming Tsau (Irvine, Calif.), Dharmendra Saraswat (Foothill Ranch, Calif.), Arun Ramakrishnan (Lake Forest, Calif.) and Reza Sharifi (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Tools and techniques for a semiconductor package providing side wall interconnections are provided. An apparatus includes two or more die layers that are bonded together, the first 3D ...