US Patent Issued to Avago Technologies International Sales on March 24 for "Stacked semiconductor method and apparatus" (American, Singaporean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,506, issued on March 24, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Stacked semiconductor method and apparatus" was invented by Mayank Mayukh (Fort Collins, Colo.), Anwar Ali (San Jose, Calif.), Jayanthi Pallinti (Los Gatos, Calif.), Shrikara Prabhu Tendel (Singapore) and Gregory Dix (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a chip package, performing a coupling of first and second interconnecting layers between one or more top dies and one or more bottom dies via hybrid copper bonding; depositing a material to at least partially cover the second interconnecting...