ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,618, issued on June 16, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).
"Thermal management systems and methods for semiconductor devices" was invented by Hyunsuk Chun (Irvine, Calif.), Reza Sharifi (Irvine, Calif.), Kian Yeow Gan (Irvine, Calif.), Nicole A. Butel (Fort Collins, Colo.) and Jin Seong Choi (Irvine, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to semiconductor devices and integrated circuit packaging. In a specific embodiment, a semiconductor device with a heat spreader structure is provided. The heat spreader is configured to couple to a second layer to establish...