US Patent Issued to Avago Technologies International Sales on Aug. 18 for "Packaging systems and methods for semiconductor devices" (American, Malaysian Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,958, issued on Aug. 18, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Packaging systems and methods for semiconductor devices" was invented by Sam Ziqun Zhao (Irvine, Calif.), Arun Ramakrishnan (Lake Forest, Calif.) and Teong Swee Tan (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to semiconductor devices and manufacturing methods thereof. In a specific embodiment, the present invention provides a semiconductor device that includes a filling material that supports the sides of an integrated circuit, which is coupled to a surface of a semiconductor substrate and surr...