US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYTEMS, SUMITOMO ELECTRIC INDUSTRIES on May 13 for "Wiring module" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,764, issued on May 13, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Wiring module" was invented by Hirokazu Komori (Mie, Japan), Makoto Higashikozono (Mie, Japan) and Koji Yamaguchi (Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One object is to provide a technology that can improve the attachability of a wiring module, in which both a grommet and a planar member are provided on a wiring member, to a door panel. The wiring module includes a wiring member, a planar member that holds the wiring member, and a grommet attached on t...