US Patent Issued to AutoNetworks Technologies, Sumitomo Wiring Systems, Sumitomo Electric Industries on May 12 for "Board module with heat dissipation portion and electrical junction box" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,085, issued on May 12, was assigned to AutoNetworks Technologies Ltd. (Yokkaishi, Japan), Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan) and Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Board module with heat dissipation portion and electrical junction box" was invented by Shun Takamizawa (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to improve heat dissipation performance while reducing a distance between boards when circuits on the boards are electrically connected to each other. The board module includes a first board including a first circuit, and a first connector provided on the first board, and the first ...