US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIES on July 21 for "Connector with integrally molded resin portions of different materials" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,146, issued on July 21, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan).

"Connector with integrally molded resin portions of different materials" was invented by Tetsuya Miyamura (Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "It is aimed to provide a connector not requiring a dedicated assembling facility. A connector (10) is provided with a primary molding portion (20A) made of a primary resin material and a secondary molding portion (50A) made of a secondary resin material. The secondary molding portion (50A) is provided relative...