US Patent Issued to AutoNetworks Technologies, Sumitomo Wiring Systems, Sumitomo Electric Industries on Dec. 2 for "Circuit assembly" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,383, issued on Dec. 2, was assigned to AutoNetworks Technologies Ltd. (Yokkaichi, Japan), Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan) and Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Circuit assembly" was invented by Hideo Morioka (Yokkaichi, Japan) and Arinobu Nakamura (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present disclosure is to provide a technique with which it is possible to achieve a weight reduction in a circuit assembly that includes two semiconductor elements that constitute a bidirectional relay A circuit assembly includes: a first bus bar; a second bus bar; a first semiconductor element...